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  SAA8122A digital still camera processor (imagic family) rev. 01 20 april 2000 objective speci?cation c c 1. description the dsc SAA8122A is a high performance, low power, single-chip million instructions per second (mips) based signal processor, part of the imagic family, which is dedicated to image processing, compression, formatting and storage. the dsc SAA8122A is optimized for use with philips range of ccds (e.g: fxa1022, 2 mpixels ccd), v-driver (tda9991), cds/pga/adc (tda9952), allowing easy implementation of a complete system solution and fast development of high performance consumer digital still cameras. the SAA8122A is designed as a single-chip device, able to perform all treatments and connections required for a wide range of digital still cameras. its embedded risc cpu, for which the development environment is available, enables shorter development and validation cycles, as well as faster feature upgrade. since one of the main objectives of the SAA8122A is addressing a wide range of ccd sensors, a dsp (with advanced embedded algorithm) for camera signal processing is integrated with a high level of programmability for pulses generation. the jpeg core is hardware based in order to allow high-speed image data compression. 2. features 2.1 general n supports a wide range of progressive ccds (vga, svga, qga, xga, eqga), with rgb bayer ?lters up to 2 mpixels n performs an advanced rgb to yuv conversion n includes a smart measurement unit to speed up the control loop (focus, auto white balance, etc.) n supports a wide range of lcd and tv formats (both ntsc and pal) with text insertion features n includes an embedded jpeg encoder/decoder unit n includes a mips pr3001 cpu, running at a frequency in a range from 12 to 28 mhz n prisc compatible pi-bus architecture, interrupt, power management, clock and reset architectures n includes a dedicated video bus supporting sdram memory for picture storage
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 2 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. n interface to rom, dram, sram, ?ash and pc card [compact flash and ssfdc (smartmedia)] n integrated general purpose peripheral units like a uart, timers, an i 2 c-bus transceiver, adc converters, rtc and i/o ports n includes usb and rs-232c communication interfaces. 2.2 external interfaces n two uart (rs-232) data ports with dma capabilities ( 187.5 kbit/s) including hardware ?ow control rxd, txd, rts, cts for modem support n 32 general purpose, bidirectional i/o interface pins, the ?rst 8 bits may also be used as interrupt inputs n two pwm outputs (8-bit resolution). 2.3 cpu related features n 32-bit pr3001 core n 1-kbyte data cache and 4-kbyte instruction cache n programmable low-power mode, including wake-up on interrupt n memory management unit [translation lookaside buffer (tlb)] n two built in 24-bit general purpose timers and one 24-bit watchdog timer n real-time clock unit (active in sleep mode) n on-chip 8-kbyte sram for storing code which needs fast execution n platform software based on real-time psos (plug-in silicon operating system). 2.4 dsp features n advanced colour reconstruction n programmable digital ?lters for noise reduction and contour enhancement n 16 programmable measurement windows allowing to perform the measurements necessary for exposure, white balance and focus adjustment in a dsc system; available measurement outputs for exposure, white balance and focus control. 2.5 pulse pattern generator features n programmable through dedicated pc-software, allowing to drive all ccds currently present in the market, as well as cds/agc/adc chips: up to 8 8 kpixels. 2.6 jpeg n fully iso10918 compliant n supports tiff, exif 2.1, dcf & dpof n quick compression (4 images/s for a 1.3 mpixels resolution). 2.7 usb interface n fully compatible with usb.
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 3 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. 2.8 card interfaces n compatible with all ssfdc/cf cards on the market. 2.9 bus n bus structure allows for parallel processing depending on software implementation, allowing easy system optimization. 2.10 sdram interface features n supports up to 128 mbyte of sdram and 16-bit wide addressses n bus speed: 1 or 2 times ccd pixel clock n 32-bit bus width. 3. quick reference data [1] the supplies considered as digital supply (v ddd ) are: v ddd , v ddd(rtc) . [2] the supplies considered as analog supply (v dda ) are: v dda(spll) , v dda(pll) , v dda(bg) , v dda(ppg1) , v dda(adc) , v dda(output1) , v dda(output2) , v dda(lcdr) , v dda(lcdg) , v dda(lcdb) , v dda(dll) . [3] including voltage on outputs in 3-state mode; only valid when supply voltage is present. 4. ordering information table 1: quick reference data symbol parameter conditions min typ max unit v ddd digital supply voltage [1] 3 3.3 3.6 v v dda analog supply current [2] 3 3.3 3.6 v i p total supply current f clk =25mhz - 360 560 ma v i input voltage general 0 - v ddd v 5 v tolerant cells only [3] 0 - 5.5 v v o output voltage output active 0 - v ddd v t amb ambient temperature 0 25 70 c f clk clock frequency - 25 27 mhz table 2: ordering information type number package name description version SAA8122Ael lfbga324 plastic low pro?le ?ne-pitch ball grid array package; 324 balls; body 16 16 1.2 mm sot571-1
philips semiconductors SAA8122A digital still camera processor (imagic family) 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. objective speci?cation rev. 01 20 april 2000 4 of 26 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here in this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... 5. block diagram fig 1. block diagram. fce686 analog digital controller power management controller i 2 c transciever rtc slave group interface four gpio pi bcu gpio + int timer timer 8k sram vdo bcu camdsp timer interupt controller interupt controller pll ccd tcb peripheral controller pr3001 cpu jpeg codec uart usb static memory controller dram memory controller ebiu SAA8122A pc-card controller
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 5 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. 6. pinning information 6.1 pinning 6.2 pin description fig 2. system block diagram. handbook, full pagewidth fce687 SAA8122A tda9952 ccd fxa1022 lens v-driver tda9991 10 to lcd to tv to cards (ssfdc, cf) usb irda to pc fig 3. pin con?guration (bottom view). handbook, halfpage fce677 a b c d e f h k g j l m n p r t u v 2 4 6 8 1012141618 1 3 5 7 9 11 13 15 17 SAA8122Ael table 3: pin description symbol pin type description v ddd a1 - digital supply voltage v ssa(dll) a2 - analog ground for dll of ppg v dda(dll) a3 - analog supply voltage for dll of ppg disp_vsync a4 o digital vertical synchronization signal io1/irq17 a5 i/o i/o port 0 bit 1 or interrupt request 17 v dda(lcdg) a6 p analog supply voltage for dac component g v dda(output2) a7 p analog supply voltage for dac video output 2
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 6 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. cref_bg1 a8 - band-gap 1 v ss(bg) a9 p ground for bg of video dac sysrstin a10 i system reset input/output; active low v ss(rtc) a11 p ground for rtc t0_cap0 a12 i timer 0 capture input 0 cnt2 a13 i timer 2 count pulse input cnt1 a14 i timer 1 count pulse input pwm0 a15 o timer 0 pwm output adc0 a16 i analog input signal 0 for level measurement adc3 a17 i analog input signal 3 for level measurement v ss(adc) a18 p ground for adc anppg1 b1 o ppg analog signal 1 io6/irq22 b4 i/o i/o port 0 bit 6 or interrupt request 22 io3/irq19 b5 i/o i/o port 0 bit 3 or interrupt request 19 lcd_g b6 o analog green signal video_out2 b7 o video output signal 2 v ssa(ref) b8 o analog reference ground sc_tck b9 i test clock input for surround scan chains tck b10 i test clock input xtalccdin b11 - oscillator input from a speci?c ccd crystal v dda(spll) b12 p analog supply voltage for spll v ss(pll) b13 p ground for pll cnt0 b14 i timer 0 count pulse input v ssa(ref)(adc) b15 o analog reference ground for adc adc2 b16 i analog input signal 2 for level measurement v dda(adc) b17 p analog supply voltage for adc io23 b18 i/o i/o port 2 bit 7 v dda(ppg1) c1 p analog supply voltage for ppg v dda(ppg0) c2 p analog supply voltage for ppg v dda(dll) c3 p analog supply voltage for dll of ppg io7/irq23 c4 i/o i/o port 0 bit 7 or interrupt request 23 io4/irq20 c5 i/o i/o port 0 bit 4 or interrupt request 20 lcd_r c6 o analog red signal lcd_b c7 o analog blue signal v dda(output1) c8 p analog supply voltage for dac video output 1 v dda(bg) c9 p analog supply voltage for bg of video dac tms c10 i test mode select input xtal32kin c11 - oscillator input from a 32 khz crystal xtal10in c12 - oscillator input from a 10 mhz crystal gate2 c13 i timer 2 gate input v dda(pll) c14 p analog supply voltage for pll table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 7 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. pwm1 c15 o timer 1 pwm output adc1 c16 i analog input signal 1 for level measurement io22 c17 i/o i/o port 2 bit 6 io16 c18 i/o i/o port 2 bit 0 anppg7 d1 o ppg analog signal 7 v ssa(ppg1) d2 p analog ground for ppg disp_hsync d3 o digital horizontal synchronization signal io5/irq21 d4 i/o i/o port 0 bit 5 or interrupt request 21 io0/irq16 d5 i/o i/o port 0 bit 0 or interrupt request 16 v ssa(lcd) d6 p analog ground for display rgb v ss(output) d7 p ground for dac video output cref_bg2 d8 - band-gap 2 tdo d9 o test data output tdi d10 i test data input xtal32kout d11 - oscillator output from a 32 khz crystal xtal10out d12 - oscillator output from a 10 mhz crystal t0_cap1 d13 i timer 0 capture input 1 gate0 d14 i timer 0 gate input pwm2 d15 o timer 2 pwm output io17 d16 i/o i/o port 2 bit 1 io15 d17 i/o i/o port 1 bit 7 io11 d18 i/o i/o port 1 bit 3 ppg1 e1 o ppg digital signal 0 ppg2 e2 o ppg digital signal 1 anppg8 e3 o ppg analog signal 8 v dda(ppg0) e4 p analog supply voltage for ppg io2/irq18 e5 i/o i/o port 0 bit 2 or interrupt request 18 v dda(lcdr) e6 p analog supply voltage for dac component r v dda(lcdb) e7 p analog supply voltage for dac component b video_out1 e8 o video output signal 1 sysrst e9 o system reset output; active low trst e10 i test reset input v ddd(rtc) e11 p digital supply voltage for rtc xtalccdout e12 - oscillator output from a speci?c ccd crystal gate1 e14 i timer 1 gate input io18 e15 i/o i/o port 2 bit 2 io10 e16 i/o i/o port 1 bit 2 io9 e17 i/o i/o port 1 bit 1 ua_clk e18 i uart external clock ppg5 f1 o ppg digital signal 4 ppg6 f2 o ppg digital signal 5 table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 8 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. ppg3 f3 o ppg digital signal 2 anppg5 f4 o ppg analog signal 5 anppg3 f5 o ppg analog signal 3 v ss f6 - ground v ss f7 - ground v dd f8 - supply voltage v dd f9 - supply voltage v dd f10 - supply voltage v dd f11 - supply voltage v dd f12 - supply voltage io20 f13 i/o i/o port 2 bit 4 io19 f14 i/o i/o port 2 bit 3 io12 f15 i/o i/o port 1 bit 4 cts f16 i uart clear to send rxd f17 i uart receive input txd f18 o uart transmit output ppg10 g1 o ppg digital signal 17 ppg12 g2 o ppg digital control signal 1 ppg8 g3 o ppg digital signal 8 ppg4 g4 o ppg digital signal 3 anppg6 g5 o ppg analog signal 6 anppg2 g6 o ppg analog signal 2 v dd g7 - supply voltage v ss g8 - ground v ss g9 - ground v ss g10 - ground v ss g11 - ground v dd g12 - supply voltage io21 g13 i/o i/o port 2 bit 5 io13 g14 i/o i/o port 1 bit 5 rts g15 o uart request to send sda g16 i/o i 2 c-bus data scl g17 i/o i 2 c-bus clock n.c. g18 - not connected hdhref h1 i/o ppg horizontal synchronization signal vdvs h2 i/o ppg vertical synchronization signal ppg13 h3 o ppg digital control signal 2 ppg7 h4 o ppg digital control signal 6 ppg14 h5 o ppg digital control signal 3 anppg4 h6 o ppg analog signal 4 v dd h7 - supply voltage table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 9 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. v ss h8 - ground v ss h9 - ground v ss h10 - ground v ss h11 - ground v dd h12 - supply voltage io14 h13 i/o i/o port 1 bit 6 rxvpi h14 i usb n.c. h15 - not connected rxvmi h16 i/o usb txvpo h17 o usb rxdata h18 i usb ccd_im2 j1 i digital image signal 2 ccd_im3 j2 i digital image signal 3 ccd_im4 j3 i digital image signal 4 ppg11 j4 o ppg digital signal 18 ppg9 j5 o ppg digital signal 8 v dd j6 - supply voltage v dd j7 - supply voltage v ss j8 - ground v ss j9 - ground v ss j10 - ground v ss j11 - ground v dd j12 - supply voltage io8 j13 i/o i/o port 1 bit 0 suspend j14 o usb txoe j15 o usb d2 j16 i/o ebiu d2 d3 j17 i/o ebiu d3 d0 j18 i/o ebiu d0 ccd_im10 k1 i digital image signal 10 ccd_im9 k2 i digital image signal 9 ccd_im8 k3 i digital image signal 8 ccd_im1 k4 i digital image signal 1 ccd_im0 k5 i digital image signal 0 v dd k6 - supply voltage v dd k7 - supply voltage v ss k8 - ground v ss k9 - ground v ss k10 - ground v ss k11 - ground v dd k12 - supply voltage table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 10 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. txvmo k13 o usb d1 k14 i/o ebiu d1 d4 k15 i/o ebiu d4 d6 k16 i/o ebiu d6 d7 k17 i/o ebiu d7 d8 k18 i/o ebiu d8 sd_a[0] l1 o sdram controller address bus bit 0 sd_a[3] l2 o sdram controller address bus bit 3 sd_a[2] l3 o sdram controller address bus bit 2 ccd_im6 l4 i digital image signal 6 ccd_im7 l5 i digital image signal 7 ccd_im5 l6 i digital image signal 5 v dd l7 - supply voltage v ss l8 - ground v ss l9 - ground v ss l10 - ground v ss l11 - ground v dd l12 - supply voltage d5 l13 i/o ebiu d5 d9 l14 i/o ebiu d9 d11 l15 i/o ebiu d11 d14 l16 i/o ebiu d14 d13 l17 i/o ebiu d13 d12 l18 i/o ebiu d12 sd_a[7] m1 o sdram controller address bus bit 7 sd_a[8] m2 o sdram controller address bus bit 8 sd_a[9] m3 o sdram controller address bus bit 9 sd_a[4] m4 o sdram controller address bus bit 4 sd_a[1] m5 o sdram controller address bus bit 1 ccd_im11 m6 i digital image signal 11 v dd m7 - supply voltage v ss m8 - ground v ss m9 - ground v ss m10 - ground v ss m11 - ground v dd m12 - supply voltage d10 m13 i/o ebiu d10 sc_se m14 o ebiu controller se signal for ssfdc card; active low d15 m15 i/o ebiu d15 pc_w ait2 m16 i ebiu controller wait signal for pc card 2; active low sc_ce m17 o ebiu controller ce signal for ssfdc card; active low table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 11 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. sc_cle m18 o ebiu controller cle signal for ssfdc card sd_a[12] n1 o sdram controller address bus bit 12 sd_a[13] n2 o sdram controller address bus bit 13 sd_a[14] n3 o sdram controller address bus bit 14 sd_a[10] n4 o sdram controller address bus bit 10 sd_a[6] n5 o sdram controller address bus bit 6 sd_a[5] n6 o sdram controller address bus bit 5 v dd n7 - supply voltage v dd n8 - supply voltage v dd n9 - supply voltage v dd n10 - supply voltage v dd n11 - supply voltage sc_ale n12 o ebiu controller ale signal for ssfdc card pc2_ce1 n13 o ebiu controller ce1 signal for pc card 2; active low pc2_ce2 n14 o ebiu controller ce2 signal for pc card 2; active low pc_reg n15 o ebiu controller reg signal for pc cards; active low pc_w ait1 n16 o ebiu controller wait signal for pc card 1; active low io wr_we n17 o ebiu controller iord signal for pc cards; active low iord_re n18 o ebiu controller iord signal for pc cards; active low sd_clkout p1 o sdram controller clock output sd_clkin p2 i sdram controller clock input sd_cs2 p3 o sdram controller chip select for memory 2; active low sd_clken p4 o sdram controller clock enable sd_a[11] p5 o sdram controller address bus bit 11 v dd p6 - supply voltage sd_d[7] p7 i/o sdram controller data bus bit 7 io25 p8 i/o i/o port 3 bit 1 io38 p9 i/o i/o port 4 bit 6 a25 p10 i/o ebiu a25 (strapin[0] during boot sequence) a21 p11 i/o ebiu a21 (strapin[4] during boot sequence) v dd p12 - supply voltage a14 p13 i/o ebiu a14 sclk p14 o ebiu controller clock signal for external peripherals a9 p15 i/o ebiu a9 cas0 p16 o ebiu controller cas signal for dram memory for lower byte; used as data strobe signal for lower byte for general chip select; active low pc1_ce1 p17 o ebiu controller ce1 signal for pc card 1; active low pc1_ce2 p18 o ebiu controller ce2 signal for pc card 1; active low sd_cs0 r1 o sdram controller chip select for memory 0; active low sd_cs1 r2 o sdram controller chip select for memory 1; active low sd_cs3 r3 o sdram controller chip select for memory 3; active low table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 12 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. sd_d[4] r4 i/o sdram controller data bus bit 4 sd_ras r5 o sdram controller row address strobe; active low sd_d[6] r6 i/o sdram controller data bus bit 6 sd_d[13] r7 i/o sdram controller data bus bit 13 io30 r8 i/o i/o port 3 bit 6 io37 r9 i/o i/o port 4 bit 5 a24 r10 i/o ebiu a24 (strapin[1] during boot sequence) a19 r11 i/o ebiu a19 (strapin[6] and strapin[9] during boot sequence) a18 r12 i/o ebiu a18 (strapin[10] during boot sequence) a13 r13 i/o ebiu a13 a5 r14 o ebiu a5 cs6 r15 o ebiu controller chip select 6; active low cas1 r16 o ebiu controller cas signal for dram memory for upper byte; used as data strobe signal for upper byte for general chip select; active low oe r17 o ebiu controller output enable signal; active low ras r18 o ebiu controller ras signal for dram memory; active low sd_cas t1 o sdram controller column address strobe; active low sd_we t2 o sdram controller write enable; active low sd_d[3] t3 i/o sdram controller data bus bit 3 sd_d[8] t4 i/o sdram controller data bus bit 8 sd_d[10] t5 i/o sdram controller data bus bit 10 sd_d[14] t6 i/o sdram controller data bus bit 14 io26 t7 i/o i/o port 3 bit 2 io29 t8 i/o i/o port 3 bit 5 io33 t9 i/o i/o port 4 bit 1 io36 t10 i/o i/o port 4 bit 4 a23 t11 i/o ebiu a23 (strapin[2] during boot sequence) a16 t12 i/o ebiu a16 a12 t13 i/o ebiu a12 a3 t14 o ebiu a3 cs7 t15 o ebiu controller chip select 7; active low cs4 t16 o ebiu controller chip select 4; active low we t17 o ebiu controller write enable signal; active low cs_w ait t18 o ebiu controller wait signal for chip selects; active low sd_dqm0 u1 o sdram controller dq mask enable for byte 0; active low sd_dqm1 u2 o sdram controller dq mask enable for byte 1; active low sd_d[2] u3 i/o sdram controller data bus bit 2 sd_d[9] u4 i/o sdram controller data bus bit 9 sd_d[11] u5 i/o sdram controller data bus bit 11 sd_d[15] u6 i/o sdram controller data bus bit 15 io27 u7 i/o i/o port 3 bit 3 table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 13 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. io32 u8 i/o i/o port 4 bit 0 io34 u9 i/o i/o port 4 bit 2 a22 u10 i/o ebiu a22 (strapin[3] during boot sequence) a17 u11 i/o ebiu a17 (strapin[11] during boot sequence) a11 u12 i/o ebiu a11 a8 u13 i/o ebiu a8 a4 u14 o ebiu a4 a2 u15 o ebiu a2 cs5 u16 o ebiu controller chip select 5; active low cs3 u17 o ebiu controller chip select 3; active low cs0 u18 o ebiu controller chip select 0; active low sd_d[0] v1 i/o sdram controller data bus bit 0 sd_d[1] v2 i/o sdram controller data bus bit 1 sd_d[5] v3 i/o sdram controller data bus bit 5 sd_d[12] v4 i/o sdram controller data bus bit 12 io24 v5 i/o i/o port 3 bit 0 io28 v6 i/o i/o port 3 bit 4 io31 v7 i/o i/o port 3 bit 7 io35 v8 i/o i/o port 4 bit 3 io39 v9 i/o i/o port 4 bit 7 a20 v10 i/o ebiu a20 (strapin[5] and strapin[8] during boot sequence) a15 v11 i/o ebiu a15 a10 v12 i/o ebiu a10 a7 v13 i/o ebiu a7 a6 v14 i/o ebiu a6 a1 v15 o ebiu a1 a0 v16 o ebiu a0 cs2 v17 o ebiu controller chip select 2; active low cs1 v18 o ebiu controller chip select 1; active low table 3: pin description continued symbol pin type description
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 14 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. 7. limiting values [1] value may not exceed 4 v. [2] including voltage on outputs in 3-state mode. [3] only valid when supply voltage is present. [4] the peak current is limited to 10 times the corresponding maximum current. [5] dependent of package and not yet determined. 8. characteristics [1] v ddd(rtc) is the single supply which may be on when the others are off. in this case the i/os of the SAA8122A have to be at 0 v. table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ddd digital supply voltage - 0.5 4 v v dda analog supply voltage - 0.5 4 v v i dc input voltage general [1] [2] - 0.5 v dd + 0.5 v 5 v tolerant cells only [2] [3] - 0.5 - 0.5 v i dd dc supply current per supply pin [4] - 60 ma i ss dc ground current per ground pin [4] - 60 ma t stg storage temperature [5] 0 125 c table 5: general supply characteristics symbol parameter conditions min typ max unit v ddd digital supply voltage 3.0 3.3 3.6 v v dda(dll) analog supply voltage for dll 3.0 3.3 3.6 v v dda(lcdr) analog supply voltage for lcdr output of dac 3.0 3.3 3.6 v v dda(lcdg) analog supply voltage for lcdg output of dac 3.0 3.3 3.6 v v dda(lcdb) analog supply voltage for lcdb 3.0 3.3 3.6 v v dda(output1) analog supply voltage for video output 1 of dac 3.0 3.3 3.6 v v dda(output2) analog supply voltage for video output 2 of dac 3.0 3.3 3.6 v v dda(adc) analog supply voltage for adc 3.0 3.3 3.6 v v dda(ppg1) analog supply voltage for ppg 3.0 3.3 3.6 v v dda(ppg0) analog supply voltage for ppg 3.0 3.3 3.6 v v dda(bg) analog supply voltage for bandgap 3.0 3.3 3.6 v v dda(pll) analog supply voltage for pll 3.0 3.3 3.6 v v dda(spll) analog supply voltage for spll 3.0 3.3 3.6 v v ddd(rtc) digital supply voltage for rtc [1] 3.0 3.3 3.6 v
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 15 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. table 6: operating characteristics symbol parameter conditions min typ max unit v dda(lcdr) analog supply voltage for lcdr output of dac 3.0 3.3 3.6 v v dda(lcdg) analog supply voltage for lcdg output of dac 3.0 3.3 3.6 v v dda(lcdb) analog supply voltage for lcdb output of dac 3.0 3.3 3.6 v v dda(output1) analog supply voltage for video output 1 of dac 3.0 3.3 3.6 v v dda(output2) analog supply voltage for video output 2 of dac 3.0 3.3 3.6 v v dda(bg) analog supply voltage for bandgap 3.0 3.3 3.6 v v bg bandgap reference voltage (4 s ) 1.18 1.22 1.26 v v ol low-level output voltage code 0 - 0.225 - v v oh high-level output voltage code 511 - 1.625 - v lcd channels (1 k w buffer) r l load resistance - 1 - k w c l load capacitance - - 5 pf res resolution - 8 - bit lcd channels (75 w mode) r l load resistance - 75 - w c l load capacitance - 5 100 pf res resolution - 9 - bit video_out channels (1 k w buffer) r l load resistance - 1 - k w c l load capacitance - - 5 pf res resolution - 8 - bit video_out channels (1 k w mode) r l load resistance - 1 - k w c l load capacitance - - 5 pf res resolution - 9 - bit adc v dda(adc) analog supply voltage for analog adc 3.0 3.3 3.6 v d v dd supply voltage difference between v dda and v dda(adc) - - 0.2 v res resolution 8 - 10 bit c i input capacitance - 2 - pf v i input voltage 0 - 3.3 v f sample sample frequency 8-bit 0 - 100 khz pll v dda(pll) analog supply voltage for analog pll 3.0 3.3 3.6 v
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 16 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. d v dd supply voltage difference between v dda and v dda(pll) - - 0.2 v f clk clock frequency - 96 - mhz spll v dda(spll) analog supply voltage for analog spll 3.0 3.3 3.6 v d v dd supply voltage difference between v dda and v dda(spll) - - 0.2 v power-on reset v trip trip level of power-on reset 1.5 2.07 2.65 v t high time that v dda has to be above 2.65 v before internal reset signal is asserted --2 m s t low time that v dda has to be above 2.65 v before internal reset signal is de-asserted --8 m s analog ppg v dda(dll) analog supply voltage for analog dll 3.0 3.3 3.6 v d v dd-dda(dll) supply voltage difference between v dda and v dda(dll) - - 0.2 v v dda(ppg1) ; v dda(ppg0) analog supply voltage for analog ppg 3.0 3.3 3.6 v d v dd-dda(ppg) supply voltage difference between v dda and v dda(ppg1) or v dda(ppg0) - - 0.2 v i/os (v ddd =v dda, t amb = 0 to 60 c) data and control inputs sd_clkin v il low-level digital input voltage 0 - 0.3v ddd v v ih high-level digital input voltage 0.7v ddd -v ddd v c i input capacitance - 1.14 - pf i il low-level input current v i =0v --1 m a i ih high-level input current v i =v ddd --1 m a i lu(i/o) i/o latch-up current - 0.5 philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 17 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. v ih high-level digital input voltage 2.0 - 5.5 v v hys hysteresis voltage 0.4 - - v c i input capacitance - 1.2 - pf i il low-level input current v i =0v --1 m a i ih high-level input current v i =v ddd --1 m a i lu(i/o) i/o latch-up current - 0.5 philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 18 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. i oz 3-state output leakage current v o =0; v o =v ddd --1 m a data and control i/os sd_d[0] to sd_d[15] v il low-level digital input voltage - 0 - 0.3v ddd v v ih high-level digital input voltage - 0.7v ddd -v ddd v v ol low-level digital output voltage i ol = 4 ma 0 - 0.4 v v oh high-level digital output voltage i oh = - 4ma v ddd - 0.4 - v ddd v c i input capacitance - - 1.2 - pf c o(l)(max) maximum output load capacitance - [1] - - 100 pf i ol low-level output current v ol = 0.4 v; v oh =v ddd - 0.4 4--ma i oh high-level output current v oh =v ddd - 0.4 - 4--ma i oz 3-state output leakage current v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a a0 to a15, io8 to io15, hdhref, vdvs v il low-level digital input voltage - 0 - 0.6v ddd v v ih high-level digital input voltage - 0.7v ddd -v ddd v v ol low-level digital output voltage i ol = 4 ma 0 - 0.4 v v oh high-level digital output voltage i oh = - 4ma v ddd - 0.4 - v ddd v c i input capacitance - - 2.5 - pf c o(l)(max) maximum output load capacitance - [1] --30pf i ol low-level output current v ol = 0.4 v; v oh =v ddd - 0.4 4--ma i oh high-level output current v oh =v ddd - 0.4 - 4--ma i oz 3-state output leakage current v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a io16 to io23, io0/irq16, io1/irq17, io2/irq18, io3/irq19, io4/irq20, io5/irq21, io6/irq22, io7/irq23 v il low-level digital input voltage - 0 - 0.3v ddd v v ih high-level digital input voltage - 0.7v ddd -v ddd v v ol low-level digital output voltage i ol = 2 ma 0 - 0.4 v v oh high-level digital output voltage i oh = - 2ma v ddd - 0.4 - - v c i input capacitance - - 2.3 - pf c o(l)(max) maximum output load capacitance - - - 30 pf i ol low-level output current v ol = 0.4 v; v oh =v ddd - 0.4 2--ma i oh high-level output current v oh =v ddd - 0.4 - 2--ma table 6: operating characteristics continued symbol parameter conditions min typ max unit
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 19 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. i oz 3-state output leakage current v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a io4 to io31 v il low-level digital input voltage - 0 - 0.8 v v ih high-level digital input voltage - 2.0 - 5.5 v v ol low-level digital output voltage i ol = 2 ma - - 0.4 v v oh high-level digital output voltage i oh = - 2ma v ddd - 0.4 - v ddd v c i input capacitance - - 1.5 - pf c o(l)(max) maximum output load capacitance - - - 30 pf i ol low-level output current v ol = 0.4 v; v oh =v ddd - 0.4 2--ma i oh high-level output current v oh =v ddd - 0.4 - 2--ma i oz 3-state output leakage current v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a io32 to io39 v il low-level digital input voltage - 0 - 0.8 v v ih high-level digital input voltage - 2.0 - 5.5 v v ol low-level digital output voltage i ol = 1 ma 0 - 0.4 v v oh high-level digital output voltage i oh = - 1ma v ddd - 0.4 - v ddd v c i input capacitance - - 1.4 - pf c o(l)(max) maximum output load capacitance - - - 30 pf i ol low-level output current v ol = 0.4 v; v oh =v ddd - 0.4 1--ma i oh high-level output current v oh =v ddd - 0.4 - 1--ma i oz 3-state output leakage current v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a i 2 c-bus i/os scl and sda v il low-level digital input voltage - 0 - 0.3v ddd v v ih high-level digital input voltage - 0 - 0.3v ddd v v hys hysteresis voltage - 0.005v ddd --v v ol low-level digital output voltage i ol = 3 ma - - 0.4 v c i input capacitance - - 3.2 - pf c o(l)(max) maximum output load capacitance - [1] - - 400 pf table 6: operating characteristics continued symbol parameter conditions min typ max unit
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 20 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. [1] the maximum capacitance value given does not take into account the signal frequency. for critical signals the maximum capaci tance has to be weighted according to the signal frequency and external devices constraints. i oz 3-state output leakage v o =0; v o =v ddd --1 m a i il low-level input current v i =0 --1 m a i ih high-level input current v i =v ddd --1 m a table 6: operating characteristics continued symbol parameter conditions min typ max unit
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 21 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. 9. package outline fig 4. sot571-1. 0.8 a 1 b a 2 unit d y e references outline version european projection issue date 00-01-20 iec jedec eiaj mm 1.70 0.45 0.35 1.35 1.05 16.1 15.9 d 1 y 1 16.1 15.9 e 1 13.6 13.6 0.55 0.45 0.12 0.10 dimensions (mm are the original dimensions) sot571-1 mo-205 e 0.15 v 0.1 w 0 5 10 mm scale sot571-1 lfbga324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm a max. a a 2 a 1 detail x y y 1 c e e d 1 ? w b x d e c b a m a b c d e f h k g j l m n p r t u v 2 4 6 8 1012141618 1 3 5 7 9 11 13 15 17 e 1 m va m vb ball a1 index area
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 22 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. 10. soldering 10.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations re?ow soldering is often used. 10.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for re?owing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. 10.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners.
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 23 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 10.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 10.5 package related soldering information [1] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [2] these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). [3] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [4] wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [5] wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 11. revision history table 7: suitability of surface mount ic packages for wave and re?ow soldering methods package soldering method wave re?ow [1] bga, lfbga, sqfp, tfbga not suitable suitable hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable [2] suitable plcc [3] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [3] [4] suitable ssop, tssop, vso not recommended [5] suitable table 8: revision history rev date cpcn description 01 20000420 - objective speci?cation; initial version
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 24 of 26 9397 750 07048 ? philips electronics n.v. 2000 all rights reserved. 12. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. 13. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 14. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 15. licenses datasheet status product status de?nition [1] objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. spec i?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a la ter date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make ch anges at any time without notice in order to improve design and supply the best possible product. purchase of philips i 2 c components purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c speci?cation de?ned by philips. this speci?cation can be ordered using the code 9398 393 40011.
philips semiconductors SAA8122A digital still camera processor (imagic family) objective speci?cation rev. 01 20 april 2000 25 of 26 9397 750 07048 ? philips electronics n.v. 2000. all rights reserved. philips semiconductors - a worldwide company argentina: see south america australia: tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: tel. +43 160 101, fax. +43 160 101 1210 belarus: tel. +375 17 220 0733, fax. +375 17 220 0773 belgium: see the netherlands brazil: see south america bulgaria: tel. +359 268 9211, fax. +359 268 9102 canada: tel. +1 800 234 7381 china/hong kong: tel. +852 2 319 7888, fax. +852 2 319 7700 colombia: see south america czech republic: see austria denmark: tel. +45 3 288 2636, fax. +45 3 157 0044 finland: tel. +358 961 5800, fax. +358 96 158 0920 france: tel. +33 14 099 6161, fax. +33 14 099 6427 germany: tel. +49 40 23 5360, fax. +49 402 353 6300 hungary: see austria india: tel. +91 22 493 8541, fax. +91 22 493 8722 indonesia: see singapore ireland: tel. +353 17 64 0000, fax. +353 17 64 0200 israel: tel. +972 36 45 0444, fax. +972 36 49 1007 italy: tel. +39 039 203 6838, fax +39 039 203 6800 japan: tel. +81 33 740 5130, fax. +81 3 3740 5057 korea: tel. +82 27 09 1412, fax. +82 27 09 1415 malaysia: tel. +60 37 50 5214, fax. +60 37 57 4880 mexico: tel. +9-5 800 234 7381 middle east: see italy netherlands: tel. +31 40 278 2785, fax. +31 40 278 8399 new zealand: tel. +64 98 49 4160, fax. +64 98 49 7811 norway: tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: tel. +63 28 16 6380, fax. +63 28 17 3474 poland: tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: tel. +27 11 471 5401, fax. +27 11 471 5398 south america: tel. +55 11 821 2333, fax. +55 11 829 1849 spain: tel. +34 33 01 6312, fax. +34 33 01 4107 sweden: tel. +46 86 32 2000, fax. +46 86 32 2745 switzerland: tel. +41 14 88 2686, fax. +41 14 81 7730 taiwan: tel. +886 22 134 2865, fax. +886 22 134 2874 thailand: tel. +66 27 45 4090, fax. +66 23 98 0793 turkey: tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine: tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: tel. +44 208 730 5000, fax. +44 208 754 8421 united states: tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: tel. +381 11 3341 299, fax. +381 11 3342 553 for all other countries apply to: philips semiconductors, international marketing & sales communications, building be, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 272 4825 internet: http://www.semiconductors.philips.com (sca69)
? philips electronics n.v. 2000. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 20 april 2000 document order number: 9397 750 07048 contents philips semiconductors SAA8122A digital still camera processor (imagic family) 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 external interfaces . . . . . . . . . . . . . . . . . . . . . . 2 2.3 cpu related features . . . . . . . . . . . . . . . . . . . . 2 2.4 dsp features . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.5 pulse pattern generator features . . . . . . . . . . . 2 2.6 jpeg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.7 usb interface . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.8 card interfaces . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.9 bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.10 sdram interface features . . . . . . . . . . . . . . . . 3 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 14 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 10.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 10.2 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 10.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 10.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 10.5 package related soldering information . . . . . . 23 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 12 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 24 13 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 14 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 15 licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24


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